Photocurable thermosetting resin composition, dry film, cured product, and electronic component comprising cured product
To provide: a photocurable thermosetting resin composition that stores exceptionally well, that leads to minimal adverse events such as pinholes and cissing in a resulting dry film, and that has exceptional electrical characteristics; a cured product of said resin composition; and an electronic comp...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.05.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To provide: a photocurable thermosetting resin composition that stores exceptionally well, that leads to minimal adverse events such as pinholes and cissing in a resulting dry film, and that has exceptional electrical characteristics; a cured product of said resin composition; and an electronic component comprising said cured product. A photocurable thermosetting resin composition composed of a resin composition of at least a two-liquid system and containing an epoxy resin (A), a carboxyl group-containing resin (B), a photopolymerization initiator (C), a photosensitive monomer (D), silica (E), barium sulfate (F), and an organic solvent, the photocurable thermosetting resin composition characterized in that a resin composition of at least a two-liquid system is used to obtain the photocurable thermosetting resin composition, the carboxyl group-containing resin (B), the photosensitive monomer (D), and the silica (E) are contained in a separate resin composition from the epoxy resin (A), the barium sulfate (F), |
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Bibliography: | Application Number: TW202110132831 |