Integrated passive device package structure, method of making the same, and substrate having the same

• Main Authors: HUANG, BEN-XIA, FENG, LEI, XIE, BING-SEN, HONG, YE-JIE, CHEN, XIAN-MING
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A integrated passive device package structure, a method for making the same, and a substrate having the same, the method has the steps of: providing an organic frame with a chip-embedding cavity and a metal pillar, laminating a first dielectric on an upper surface of the organic frame, and performin...