Integrated passive device package structure, method of making the same, and substrate having the same

• Main Authors: HUANG, BEN-XIA, FENG, LEI, XIE, BING-SEN, HONG, YE-JIE, CHEN, XIAN-MING
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A integrated passive device package structure, a method for making the same, and a substrate having the same, the method has the steps of: providing an organic frame with a chip-embedding cavity and a metal pillar, laminating a first dielectric on an upper surface of the organic frame, and performing lithography to the first dielectric to form an opening; mounting an electronic component to the chip-embedding cavity via the opening, the electronic component including an upper electrode and a lower electrode; laminating a second electric to the chip-embedding cavity and an upper surface of the first electric and curing; thinning the first electric and the second electric to expose the upper electrode, the lower electrode, and upper and lower surfaces of the metal pillar; electroplating a metal to form a circuit layer, the circuit layer connected with the upper electrode, the lower electrode, and the metal pillar. The integrated passive device package structure, the method of making the same, and the substrate