Ring structure with compliant centering fingers

Improved edge rings with wafer-centering roller mechanisms are disclosed. The roller mechanisms of these apparatuses are equipped with spring-biased rollers that are urged radially inward such that the rollers may move radially inward or outward to compensate for differential temperature expansion b...

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Bibliographic Details
Main Authors LIND, GARY BRIDGER, TUCKER, JEREMY TODD
Format Patent
LanguageChinese
English
Published 01.01.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Improved edge rings with wafer-centering roller mechanisms are disclosed. The roller mechanisms of these apparatuses are equipped with spring-biased rollers that are urged radially inward such that the rollers may move radially inward or outward to compensate for differential temperature expansion between wafers and the edge ring over a large temperature range while still maintaining high placement accuracy at both high and low temperatures.
Bibliography:Application Number: TW202110107692