Thermal conductivity improver, thermal conductivity improvement method, thermal-conductive resin composition and thermal-conductive resin molded product

• Main Authors: TAKAHASHI, KATSUHIRO, IWAMOTO, YOSHIHITO
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2021
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is a resin composition having excellent thermal conductivity. This thermal-conductive resin composition comprises a resin, a first thermal-conductive filler having an aspect ratio of 10 or higher and a longer diameter of less than 30 [mu]m, and a second thermal-conductive filler having an a...