Thermal conductivity improver, thermal conductivity improvement method, thermal-conductive resin composition and thermal-conductive resin molded product

Provided is a resin composition having excellent thermal conductivity. This thermal-conductive resin composition comprises a resin, a first thermal-conductive filler having an aspect ratio of 10 or higher and a longer diameter of less than 30 [mu]m, and a second thermal-conductive filler having an a...

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Bibliographic Details
Main Authors TAKAHASHI, KATSUHIRO, IWAMOTO, YOSHIHITO
Format Patent
LanguageChinese
English
Published 01.04.2021
Subjects
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Provided is a resin composition having excellent thermal conductivity. This thermal-conductive resin composition comprises a resin, a first thermal-conductive filler having an aspect ratio of 10 or higher and a longer diameter of less than 30 [mu]m, and a second thermal-conductive filler having an aspect ratio of 2 or smaller.
Bibliography:Application Number: TW20209127638