Resin material and multilayer printed wiring board
The present invention provides a resin material which is capable of suppressing warping of a cured product, while being capable of shortening the baking time. A resin material according to the present invention contains an inorganic filler and a thermosetting compound which does not have an aromatic...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.03.2021
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Subjects | |
Online Access | Get full text |
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