Resin material and multilayer printed wiring board

• Main Authors: KUBO, AKIKO, BABA, SUSUMU, HAYASHI, TATSUSHI, KAWAHARA, YUKO
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention provides a resin material which is capable of suppressing warping of a cured product, while being capable of shortening the baking time. A resin material according to the present invention contains an inorganic filler and a thermosetting compound which does not have an aromatic ring in structural portions other than thermosetting functional groups, while having two or more terminal CH3 groups in structural portions other than thermosetting functional groups, and which satisfies formula (X); and the content of the inorganic filler in 100% by weight of the components of the resin material excluding solvents is 30% by weight of more. Formula (X): 0.1 ≤ A/(B * C) ≤ 0.6 A: the number of terminal CH3 groups in structural portions of the thermosetting compound other than thermosetting functional groups B: the number of thermosetting functional groups in the thermosetting compound C: the number of carbon atoms in structural portions of the thermosetting compound other than thermosetting function