Epoxy resin composition for encapsulation of semiconductor devices and semiconductor device

• Main Authors: BAE, KYOUNGUL, KIM, MIN-SOO, LEE, JI HYE, PARK, YONG-YEOP, HONG, IL-GEUN, YOON, JI-AH, LEE, DONG-HWAN
• Format: Patent
• Language: Chinese; English
• Published: 16.02.2020
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the same. The epoxy resin composition includes: an epoxy resin; a curing agent; and a first inorganic filler including at least one type of metal particles selected from among copper, nickel, aluminum, silver and gold particles coated with at least one selected from among silica and alumina.