Resin material and multilayer printed wiring board

• Main Authors: BABA, SUSUMU, HAYASHI, TATSUSHI, KAWAHARA, YUKO
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

A resin material is provided which can (1) reduce the dielectric loss tangent of a cured product, (2) increase adhesion between an insulation layer and a metal layer, (3) increase the plated peel strength, (4) increase flame retardancy of the cured product and (5) keep the curing temperature low. This resin material contains an N-alkyl bismaleimide compound having a skeleton derived from dimer diamines or an N-alkyl benzoxazine compound having a skeleton derived from dimer diamines, an epoxy compound, an inorganic filler material, and a curing agent containing a specific component, wherein the weight ratio of the content of the N-alkyl bismaleimide compound having a skeleton derived from dimer diamines or the N-alkyl benzoxazine compound having a skeleton derived from dimer diamines to the total content of the epoxy compound and the curing agent is 0.05-0.75.