Dicyclopentadiene structure-containing active polyester and low-dielectric epoxy resin cured product thereof having high thermal properties and low dielectric properties

The present invention provides a dicyclopentadiene structure-containing active polyester and a low-dielectric epoxy resin cured product thereof. The polyester has the following structure: R1 and R2 are selected from one of the group consisting of a hydrogen group, a C1-C6 alkyl group, a phenyl group...

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Main Authors JUANG, TZONG-YUAN, LIN, CHIA-MIN, LIN, CHING-HSUAN, SU, WENIUNG, CHEN, CHIEN-HAN
Format Patent
LanguageChinese
English
Published 01.12.2019
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Abstract The present invention provides a dicyclopentadiene structure-containing active polyester and a low-dielectric epoxy resin cured product thereof. The polyester has the following structure: R1 and R2 are selected from one of the group consisting of a hydrogen group, a C1-C6 alkyl group, a phenyl group, and a CF3 group, R3 is or, n is 20 a positive integer of 20-200. As a result, when the dicyclopentadiene and the active ester group are introduced into the polyester main chain, the epoxy cured product produced therefrom exhibits high thermal properties and low dielectric properties.
AbstractList The present invention provides a dicyclopentadiene structure-containing active polyester and a low-dielectric epoxy resin cured product thereof. The polyester has the following structure: R1 and R2 are selected from one of the group consisting of a hydrogen group, a C1-C6 alkyl group, a phenyl group, and a CF3 group, R3 is or, n is 20 a positive integer of 20-200. As a result, when the dicyclopentadiene and the active ester group are introduced into the polyester main chain, the epoxy cured product produced therefrom exhibits high thermal properties and low dielectric properties.
Author LIN, CHING-HSUAN
LIN, CHIA-MIN
SU, WENIUNG
JUANG, TZONG-YUAN
CHEN, CHIEN-HAN
Author_xml – fullname: JUANG, TZONG-YUAN
– fullname: LIN, CHIA-MIN
– fullname: LIN, CHING-HSUAN
– fullname: SU, WENIUNG
– fullname: CHEN, CHIEN-HAN
BookMark eNqNjk1OwzAQhbMoC1q4w3CASOkPiy4RUPUAkVhW1uQlGcm1LXsayJF6yzoI1C67etL7-Wbmxcx5h8fi_CE8svUBTk0jcKCk8cR6iijZZ1OcuI4Mqwyg4O2IpIhkXEPWf5d5Y8EahQnB_4wUkcQR531DIfoms0h7RPiWejNMsF66_tc7Gjt1AqIK0j-TbpjX9Kl4aI1NeP7TRfGy-6zf92U-e0AKhvPzeqi_VtVyu3ndrKu39T2dC_AkXKs
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID TW201945430A
GroupedDBID EVB
ID FETCH-epo_espacenet_TW201945430A3
IEDL.DBID EVB
IngestDate Fri Jul 19 16:06:14 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_TW201945430A3
Notes Application Number: TW20187114239
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191201&DB=EPODOC&CC=TW&NR=201945430A
ParticipantIDs epo_espacenet_TW201945430A
PublicationCentury 2000
PublicationDate 20191201
PublicationDateYYYYMMDD 2019-12-01
PublicationDate_xml – month: 12
  year: 2019
  text: 20191201
  day: 01
PublicationDecade 2010
PublicationYear 2019
RelatedCompanies NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
RelatedCompanies_xml – name: NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Score 3.3461108
Snippet The present invention provides a dicyclopentadiene structure-containing active polyester and a low-dielectric epoxy resin cured product thereof. The polyester...
SourceID epo
SourceType Open Access Repository
SubjectTerms CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Title Dicyclopentadiene structure-containing active polyester and low-dielectric epoxy resin cured product thereof having high thermal properties and low dielectric properties
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191201&DB=EPODOC&locale=&CC=TW&NR=201945430A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1NT4NAEJ3UatSbVo3Wj6yJ4UZsC6X00BgLbRoT28ag7a2BYUkxCMRiav1H_ktnl9b2ohcCOzCQIbM7A2_eANzoTQzcCgY0-_lICYqJqqtpDdV3PdRqTb1e4xJt0Td6z_rDuD4uwOuqFkbyhM4lOSJ5FJK_Z3K-TtcfsWyJrZzdeiENJXddp2Ury-yYkg_aKHa71RkO7IGlWFbLGSn9JynT67pWud-CbRFGC579zktbVKWkm0tK9wB2hqQtzg6h8DUtwZ616rxWgt3H5Q9v2l363uwIvu0QFxiJdleZxGlxlpO_frxzVSDO814PzJUzGEuTaCFZEJgb-yxK5qof5j1vQmT0MJ8LRpl2GDOk632W5syvTMSDPAmYKN4nZYLNWI69uZE4JxUwbD5b6WQbOtfSY7judhyrp9JtJr8GnjijtXm0EyjGScxPgVGsJNr3VT1P43rDNJpYc00DeRXRMAIzOIPy33rK_wnPYV8c5LCQCyiStfglLe6ZdyXfyg-zwLAS
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ7Uaqw3rRqtrzUx3IgtUEoPjbHQpmpfMWh7a2BZIgaBWEyt_8h_6ezS2l70QsgODGTIzO4s33wDcKXVqe-UqY_Rz6OYoBhUdlS1JnuOS1WlrlUVJtAWfb3zpN2Pq-McvC5rYQRP6EyQI6JHUfT3VMTrZLWJZQls5fTaDXAovmnbDUtaZMeYfOBBspqN1nBgDUzJNBv2SOo_CplW1dTy7QZs1jg7L186PTd5VUqyPqW0d2FriNqidA9yXy9FKJjLzmtF2O4tfnjj6cL3pvvwbQV0TkPe7ioVOC1GMvLXj3cmc8R51uuBOCKCkSQO54IFgTiRR8J4JntB1vMmoARf5nNOMNMOIkLxfo8kGfMr4etBFvuEF--jMs5mLMbenJBfk3AYNpsudZI1nSvpAVy2W7bZkfExk18DT-zRyjzqIeSjOGJHQHCtxNv3VVxXZVrN0OtUcQydsgqluu4b_jGU_tZT-k94AYWO3etOunf9hxPY4YIMInIKebQcO8OJPnXPxRf6ARr2sv8
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Dicyclopentadiene+structure-containing+active+polyester+and+low-dielectric+epoxy+resin+cured+product+thereof+having+high+thermal+properties+and+low+dielectric+properties&rft.inventor=JUANG%2C+TZONG-YUAN&rft.inventor=LIN%2C+CHIA-MIN&rft.inventor=LIN%2C+CHING-HSUAN&rft.inventor=SU%2C+WENIUNG&rft.inventor=CHEN%2C+CHIEN-HAN&rft.date=2019-12-01&rft.externalDBID=A&rft.externalDocID=TW201945430A