Mold release film for use in mold formation and mold formation method

• Main Authors: TSUJIUCHI, NAOKI, NAKAGAKI, TAKAMITSU, SUGIYAMA, RYUICHI
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2019
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Provided are: a mold release film that is for use in mold formation, and that is characterized by being provided with a mold release layer comprising composition (I) or composition (II) disposed on a base material film; and a mold formation method using same. Composition (I) comprises: a compound (a...