Composition, method for producing film, and method for producing photosensor

• Main Authors: OKAWARA, TAKAHIRO, NARA, YUKI
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS THEREOF; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INORGANIC CHEMISTRY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; NON-METALLIC ELEMENTS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is a composition capable of producing a film which has a small refractive index and in which defects are suppressed. Also provided is a method for producing a film and a method for producing a photosensor. This composition includes colloidal silica particles and a solvent. The colloidal silica particles have an average particle diameter D1 of 25-1000 nm as measured by a dynamic light scattering method, where the ratio D1/D2 of the average particle diameter D1 and an average particle diameter D2 that is calculated from the specific surface area of the colloidal silica particles measured by a nitrogen adsorption method, is 3 or greater. The solvent includes: a solvent A1 having a boiling point of 245 DEG C or higher and a solubility parameter of less than 11.3 (cal/cm3)0.5; and a solvent A2 having a boiling point of 120 DEG C or higher but less than 245 DEG C and a solubility parameter of 11.3 (cal/cm3)0.5 or higher.