Copper-clad laminate and production method for same

• Main Authors: ORITA, TAKAHIRO, IWAISAKO, YASUSHI, FURUKAWA, KOUTARO, OOGAMI, HIROYUKI, UENO, YASUTSUGU
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TRANSPORTING

The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m.K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin.