Plasma etching apparatus for printed circuit board

• Main Authors: LIU, PIN-JUN, CAI, MING-ZHAN, LIN, ZI-PING, CHEN, SONG-JIAO, YANG, CHUNIEN
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A plasma etching apparatus for printed circuit board, which is to perform an etching process on at least one printed circuit board. The plasma etching apparatus comprises a chamber, at least one plasma etching electrode, at least one gas stream absorption plate, and at least one fixed component. The gas stream adsorption plate includes a substrate, a suction hole running through the substrate, and an adsorption unit disposed on the substrate and adjacent to one side of the plasma etching electrode. The plasma etching electrode, the at least one gas stream adsorption plate and the at least one fixed component are all disposed in the chamber, and the fixed component is arranged between the plasma etching electrode and the gas stream absorption plate and fixedly corresponds to the printed circuit board, so that the printed circuit board can, with the adsorption unit, be absorbed onto the gas stream absorption plate, which thereby enables the printed circuit board to perform the plasma etching process in a stable