Method of cleaning substrate processing apparatus

• Main Authors: OSADA, NAOYUKI, SUGIMOTO, KENTARO
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a washing treatment method which washes an upper surface and a periphery of a cup without providing a special washing mechanism. An upper end of a process cup (40) enclosing a periphery of the spin base (21) is placed lower than a holding surface (21a) of the spin base (21) and a cleaning liquid is supplied from a discharge head (31) to the holding surface (21a) while the spin base (21) is being rotated at a speed ranging from 250 rpm to 350 rpm (a first rotation number). Then, an outer side upper surface (43d) of the process cup (40) is washed with the cleaning liquid dispersed from the holding surface (21a) of the rotating spin base (21). Then, the cleaning liquid is supplied from the discharge head (31) to the holding surface (21a) and a partition plate (15) and a side wall (11) of a chamber (10), which are located on the outer side of the process cup (40), are washed with the cleaning liquid dispersed from the rotating holding surface (21a) while the spin base (21) is being rotated at a speed r