Light emitting diode device and leadframe array for packaging light emitting diode

A light emitting diode device includes a leadframe module, a reflective member and a light emitting diode. The leadframe module includes two leadframe members arranged side by side, wherein each of the leadframe members includes a bonding platform and a bonding pad, the bonding platform includes an...

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Main Authors LIN, YU-FENG, LEE, HAOUNG, TSAI, MENG-TING
Format Patent
LanguageChinese
English
Published 16.10.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A light emitting diode device includes a leadframe module, a reflective member and a light emitting diode. The leadframe module includes two leadframe members arranged side by side, wherein each of the leadframe members includes a bonding platform and a bonding pad, the bonding platform includes an upper surface and a lower surface, and the bonding pad is extended from the lower surface of the bonding platform. A width of the bonding pad is smaller than a width of the bonding platform, and a height of the bonding pad is larger than a height of the bonding platform. The reflective member covers the leadframe module and the upper surface of the bonding platform is partially exposed. The light emitting diode is disposed on the exposed upper surfaces of two bonding platforms.
AbstractList A light emitting diode device includes a leadframe module, a reflective member and a light emitting diode. The leadframe module includes two leadframe members arranged side by side, wherein each of the leadframe members includes a bonding platform and a bonding pad, the bonding platform includes an upper surface and a lower surface, and the bonding pad is extended from the lower surface of the bonding platform. A width of the bonding pad is smaller than a width of the bonding platform, and a height of the bonding pad is larger than a height of the bonding platform. The reflective member covers the leadframe module and the upper surface of the bonding platform is partially exposed. The light emitting diode is disposed on the exposed upper surfaces of two bonding platforms.
Author TSAI, MENG-TING
LIN, YU-FENG
LEE, HAOUNG
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Snippet A light emitting diode device includes a leadframe module, a reflective member and a light emitting diode. The leadframe module includes two leadframe members...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Light emitting diode device and leadframe array for packaging light emitting diode
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