Adhesive composition, adhesive tape, method for processing semiconductor wafer and method for producing tsv wafer

• Main Authors: TONEGAWA, TORU, SUGITA, DAIHEI, NOMURA, SHIGERU
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HETEROCYCLIC COMPOUNDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC CHEMISTRY; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The present invention aims to provide an adhesive composition having high adhesive strength, as well as being easily detachable and having excellent heat resistance, an adhesive tape comprising the adhesive composition, a method for treating a semiconductor wafer using the adhesive tape, and a method for producing a TSV wafer. The present invention relates to an adhesive composition comprising: an adhesive component; and a tetrazole compound represented by the following formula (1), formula (2), or formula (3), or its salt: wherein R1 and R2 each may be hydrogen, a hydroxy group, an amino group, or a C1-C7 alkyl group, alkylene group, phenyl group, or mercapto group; and the C1-C7 alkyl group, alkylene group, phenyl group, and mercapto group may be substituted.