Wet activation of ruthenium containing liner/barrier
Methods and systems are provided for preparing a ruthenium containing liner/barrier for metal deposition, and are useful in the manufacture of integrated circuits. In accordance with one embodiment, a borohydride solution having a pH greater than 12 is mixed with DI water at the place of application...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
16.10.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Methods and systems are provided for preparing a ruthenium containing liner/barrier for metal deposition, and are useful in the manufacture of integrated circuits. In accordance with one embodiment, a borohydride solution having a pH greater than 12 is mixed with DI water at the place of application to form a pretreatment solution. The pretreatment solution is applied to reduce a ruthenium-containing surface of a substrate. Following reduction of the ruthenium containing surface, copper deposition may be initiated. |
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Bibliography: | Application Number: TW20132143864 |