Semiconductor constructions and methods of forming semiconductor constructions

• Main Authors: PARKER, RANDALL S, SUN, YANG-YANG, LI, JIN, GANDHI, JASPREET S
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Some embodiments include semiconductor constructions. The constructions have an electrically conductive post extending through a semiconductor die. The post has an upper surface above a backside surface of the die, and has a sidewall surface extending between the backside surface and the upper surfa...