Work polishing apparatus

• Main Authors: KASUO, MANABU, WADA, MASAKI, KOYAMA, HARUMICHI, MOROZUMI, YOICHI
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2014
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The work polishing apparatus comprises: a polishing plate having an upper face, on which a polishing cloth is adhered, and being capable of rotating in a horizontal plane; a top ring being provided above the polishing plate and being capable of moving upward and downward and rotating in a horizontal plane, the top ring being capable of pressing a carrier plate, which is placed between the polishing plate and the top ring and which holds a work on a bottom face, so as to press the work onto the polishing plate; and a stopper being provided to the top ring, the stopper stopping and holding the carrier plate, which is mounted on the polishing plate and moved into the lower side of the top ring by turning the polishing plate, at a polishing position.