Additive for improving the layer thickness distribution in barrel plating electrolytes

The present invention is directed to the use of particular thiourea compounds in a process for the electrolytic deposition of gold and gold alloys. In the process, a higher deposition of gold is achieved in regions of low current density by means of additives which are added to the electrolyte.

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Bibliographic Details
Main Author PETERS, ALEXANDER VOLKER
Format Patent
LanguageChinese
English
Published 01.11.2013
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The present invention is directed to the use of particular thiourea compounds in a process for the electrolytic deposition of gold and gold alloys. In the process, a higher deposition of gold is achieved in regions of low current density by means of additives which are added to the electrolyte.
Bibliography:Application Number: TW20130107670