Multilayer molded product and manufacturing method thereof, and electromagnetic wave shielding member and heat radiating member

• Main Authors: TOMITA, YUSUKE, KIBA, SHIGEO, IIDA, KENJI, IMAGAWA, KIYOMI
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2013
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

A multilayer molded product 1 of the invention includes: a binder resin/filler composite 21 containing a binder resin and an inorganic filler ranging from 30 vol% to 95 vol%; and an adhesive strengthened resin layer 11 laminated on at least one principal surface of the binder resin/filler composite 21. A thickness of the adhesive strengthened resin layer 11 ranges from 50 nm to 9 m. A glass transition temperature of the adhesive strengthened resin layer 11 ranges from 120 DEG C to less than 260 DEG C, and a polyimide resin containing an aliphatic unit which a carbon quantity is equal to or more than 3 in a main chain is used as a main component of the adhesive strengthened resin layer 11.