Organic encapsulant compositions for protection of electronic components
An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals and pass 1000 hours of accelerated life testing conducted under high humidity, elevated temperature and applied DC b...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
16.12.2007
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals and pass 1000 hours of accelerated life testing conducted under high humidity, elevated temperature and applied DC bias. |
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| AbstractList | An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals and pass 1000 hours of accelerated life testing conducted under high humidity, elevated temperature and applied DC bias. |
| Author | SUMMERS, JOHN D MAJUMDAR, DIPTARKA BORLAND, WILLIAM J RENOVALES, OLGA L DUEBER, THOMAS E |
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| Notes | Application Number: TW200796112516 |
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| RelatedCompanies | E. I. DU PONT DE NEMOURS AND COMPANY |
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| Snippet | An organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Organic encapsulant compositions for protection of electronic components |
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