Methods and apparatuses for sensing temperature of multi-via heater chips

• Main Authors: HALL, ERIC SPENCER, BARKLEY, LUCAS DAVID, GIBSON, BRUCE DAVID, KING, DAVID G, PARISH, GEORGE K
• Format: Patent
• Language: Chinese; English
• Published: 16.08.2007
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heate...