Substrate with plane patterns and display device using the same

• Main Authors: NISHIMURA, ETSUKO, SUZUKI, TAKAAKI, KANEKO, HIROKI, TAKAHASHI, TAKUYA, TSUTSUI, YOSHITAKA, ABE, MAKOTO
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2006
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

To obtain a board having a planar pattern at a high accuracy by reducing or eliminating an occurrence of abnormal patterns in the pattern to be formed in the liquid process of an ink-jet method or the like. A bar-shaped pull-out pattern (203) is disposed in a terminal (103) which is formed as a comb-shaped tooth pattern (201), and a width DTH of each of the comb-shaped tooth patterns (201) is set as a same value as a width DG of a scan signal wiring (102). Further, the respective comb-shaped tooth patterns (201) are connected to each other by a comb-shaped connection pattern (202) formed vertically. A width DTV of the comb-shaped tooth connection pattern (202) is set as a same value as the width DG of the scan signal wiring (102). Thus, by applying this planar pattern, although pressures of feature points a, b in Fig. 1(a) are 0.1 times a feature point e in a conventional planar pattern, the pressures are fairly improved to be 1.0 time.