Solder composition and method for forming a solder layer with the solder composition

• Main Authors: FURUNO, MASAHIKO, SAITO, HIROSHI, SAKAMOTO, ISAO, SHIRAI, MASARU
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2006
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

This invention relates to a solder composition 10 which is used to form the solder layer to electrode 21 installed on substrate 20, a solder powder consisted of a lot of solder particles 12 coated with organic film 11, and a medium 13 that has the boiling point more than the melting point of the solder powder. The solder layer on electrode 21 is formed by growing up the solder particle 12 on the solder layer. Therefore, the growth of the solder layer will stop when the amount of organic film for each unit surface area in the solder layer reaches constant during the growth of solder particle 12. In other words, a final amount of solder in the solder layer is determined by the initial size of the solder particle 12 and the amount of organic film 11. As a result, because the at least necessity of growing solder particle 12 on electrode 21 can be inhibited, a short defect of electrode 21 can be prevented.