Microstructure cooler and use thereof

• Main Authors: MARKUS HOHN, THEISEN, SVEN, CRAMER, KONRAD, PRECHTL, PETER, MEYER, HEINRICH, KURTZ, OLAF
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2004
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COLD ROOMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT PUMP SYSTEMS; HEATING; ICE-BOXES; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; PRINTED CIRCUITS; REFRIGERATION OR COOLING; REFRIGERATORS; SEMICONDUCTOR DEVICES; WEAPONS

The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 m, a depth in the range of 25 to 1,000 m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 m, and the base plate 5 has a thickness in the range of 200 to 2,000 m.