Multi-layer solder seal band for semiconductor substrates and process thereof
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Main Authors | , , , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
30.03.1999
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Author | ELLSWORTH, MICHAEL JOSEPH, JR GOLDMANN LEWIS SIGMUND SHERIE, RAED, A TOY, HILTON, T POMPEO FRANK LOUIS COFFIN JEFFERY THOMAS COURTNEY MARK GERARD DROFITZ, STEPHEN, S., JR SABLINSKI WILLIAM EDWARD IRUVANTI SUSHUMNA EDWARDS DAVID LINN CAMMARANO ARMANDO SALVATORE |
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Notes | Application Number: SG19980000886 |
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PublicationDate_xml | – month: 03 year: 1999 text: 19990330 day: 30 |
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RelatedCompanies | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
Title | Multi-layer solder seal band for semiconductor substrates and process thereof |
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