HEAT SINK FOR SEMICONDUCTOR PACKAGE

• Main Authors: TIU, KONG BEE, MUNIANDY, KESAVAKUMAR V.C, IBRAHIM, RUZAINI
• Format: Patent
• Language: English
• Published: 28.09.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A heat sink (10) for a semiconductor package (38) includes a top surface (12) having a recessed hole (16) at its center. A sidewall (14) formed around the top surface (12) of the heat sink (10) has gaps (18) formed in the sidewall (14). An air vent (22) is formed at a corner of the heat sink (10). T...