HEAT SINK FOR SEMICONDUCTOR PACKAGE

A heat sink (10) for a semiconductor package (38) includes a top surface (12) having a recessed hole (16) at its center. A sidewall (14) formed around the top surface (12) of the heat sink (10) has gaps (18) formed in the sidewall (14). An air vent (22) is formed at a corner of the heat sink (10). T...

Full description

Saved in:
Bibliographic Details
Main Authors TIU, KONG BEE, MUNIANDY, KESAVAKUMAR V.C, IBRAHIM, RUZAINI
Format Patent
LanguageEnglish
Published 28.09.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A heat sink (10) for a semiconductor package (38) includes a top surface (12) having a recessed hole (16) at its center. A sidewall (14) formed around the top surface (12) of the heat sink (10) has gaps (18) formed in the sidewall (14). An air vent (22) is formed at a corner of the heat sink (10). The heat sink (10) is used for center gate molding. Mold compound (24) enters the recessed hole (16), covers an IC die 30, and exits via the gaps (18). During mold injection, air escapes through the air vent (22).
Bibliography:Application Number: SG20070011976