METHOD DUPLEX AND METHOD

Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.

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Bibliographic Details
Main Authors LAU DANNY, KWOK RAYMUND W. M
Format Patent
LanguageEnglish
Published 26.04.2007
Subjects
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Summary:Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.
Bibliography:Application Number: SG20060061469