Non-contacting type ic card and method for fabricating the same

The swelling in the surface of an IC card due to occluded pneumatic foams is eliminated by providing a novel IC card (1), which is comprised of a substrate mounting an IC chip and an antenna circuit (5), and wherein the substrate (2) is sandwiched at least between a pair of films (4a,4b), and the pa...

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Bibliographic Details
Main Authors OBATA KYOKO, KANO KENICHI, KUDO TAKAO, NISHIMURA KIMITAKA
Format Patent
LanguageEnglish
Published 29.09.2006
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Summary:The swelling in the surface of an IC card due to occluded pneumatic foams is eliminated by providing a novel IC card (1), which is comprised of a substrate mounting an IC chip and an antenna circuit (5), and wherein the substrate (2) is sandwiched at least between a pair of films (4a,4b), and the pair of the films are provided with an uneven pattern made of small grooves formed at least on one surface thereof opposing the substrate.
Bibliography:Application Number: SG20010005619