FILM FORMING METHOD AND ALUMINUM NITRIDE FILM FORMING METHOD FOR SEMICONDUCTOR APPARATUS

Provided are a film forming method of a semiconductor device and an aluminium nitride film forming method of a semiconductor device. The film forming method of a semiconductor device comprises performing multiple sputtering processes in sequence. Each sputtering process comprises the steps of: loadi...

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Bibliographic Details
Main Authors GENG, Yujie, WANG, Jun, GUO, Bingliang, MA, Huaichao, DONG, Boyu
Format Patent
LanguageEnglish
Published 28.12.2018
Subjects
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