POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS

OF THE DISCLOSURE Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with imp...

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Main Authors DAVENPORT, Rob, FUNG, Jason G, MENK, Gregory E, CORNEJO, Mario, PATIBANDLA, Nag B, KHANNA, Aniruddh Jagdish, ORILALL, Mahendra C, BAJAJ, Rajeev, FU, Boyi, KUMAR, Ashavani, NG, Hou Tee, HARIHARAN, Venkatachalam, YAMAMURA, Mayu Felicia, SINHA, Amritanshu, CHOCKALINGAM, Ashwin, KAKIREDDY, Raghava, REDEKER, Fred C, REDFIELD, Daniel
Format Patent
LanguageEnglish
Published 30.05.2019
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