LIQUID SEALING MATERIAL AND ELECTRONIC COMPONENT USING SAME
The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present inve...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
06.04.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm. |
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Bibliography: | Application Number: PH20151500108 |