STIFFENER-INTEGRATED INTERCONNECT BYPASSES FOR CHIP-PACKAGE APPARATUS AND METHODS OF ASSEMBLING SAME

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Main Authors KONG, JACKSON CHUNG PENG, HECK, HOWARD L, ONG, JENNY SHIO YIN, CHEAH, BOK ENG, LIM, SEOK LING
Format Patent
LanguageEnglish
Published 29.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract -As attached -
AbstractList -As attached -
Author CHEAH, BOK ENG
ONG, JENNY SHIO YIN
HECK, HOWARD L
LIM, SEOK LING
KONG, JACKSON CHUNG PENG
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– fullname: LIM, SEOK LING
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title STIFFENER-INTEGRATED INTERCONNECT BYPASSES FOR CHIP-PACKAGE APPARATUS AND METHODS OF ASSEMBLING SAME
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