UNIFORM CMP POLISHING METHOD

The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad (10) having radial feeder grooves in a polishing layer (12) separating the polishing layer (12) into polishing regions...

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Bibliographic Details
Main Authors MR. JOHN VU NGUYEN, MR. JEFFREY JAMES HENDRON, MR. TONY QUAN TRAN, MR. JEFFREY ROBERT STACK
Format Patent
LanguageEnglish
Published 20.02.2024
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad (10) having radial feeder grooves in a polishing layer (12) separating the polishing layer (12) into polishing regions (40, 42, 44, 46, 48, 50, 52 and 54). The radial feeder grooves (20, 22, 24, 26, 28, 30, 32 and 34) extend at least from a location adjacent the center (16) to a location adjacent the outer edge (18). Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center (16) and outer walls closer to the outer edge (18). Pressing and rotating the wafer against the rotating polishing pad (10) for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid. (Fig.1)
Bibliography:Application Number: MY2018PI01182