SUBSTRATE HANDLING DEVICE FOR A WAFER

The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: - an end effector, - a straightening ring, and - a suction cup The suction cup is arranged within the straightening...

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Bibliographic Details
Main Authors EIBL, Manuel, OETZLINGER, Herbert, Andreas GLEISSNER
Format Patent
LanguageEnglish
Published 19.06.2023
Subjects
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