SUBSTRATE HANDLING DEVICE FOR A WAFER
The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: - an end effector, - a straightening ring, and - a suction cup The suction cup is arranged within the straightening...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
19.06.2023
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Subjects | |
Online Access | Get full text |
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