SUBSTRATE HANDLING DEVICE FOR A WAFER

The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: - an end effector, - a straightening ring, and - a suction cup The suction cup is arranged within the straightening...

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Bibliographic Details
Main Authors EIBL, Manuel, OETZLINGER, Herbert, Andreas GLEISSNER
Format Patent
LanguageEnglish
Published 19.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises: - an end effector, - a straightening ring, and - a suction cup The suction cup is arranged within the straightening ring. At least the straightening ring is releasably attached to the end effector. A first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply. The suction cup projects from the straightening ring in a normal pressure state. The suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate.
Bibliography:Application Number: MYPI2021006017