METHOD, APPARATUS AND SYSTEM FOR CONFIGURING A PROTOCOL STACK OF AN INTEGRATED CIRCUIT CHIP
Techniques and mechanisms for configuring an integrated circuit, IC, chip (120) to implement a protocol stack. In an embodiment, a transaction layer of the IC chip (120) is operable to exchange with a link layer of the IC chip transaction layer packets, TLPs, having a format compatible with one defi...
Saved in:
Main Authors | , , , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
22.09.2021
|
Online Access | Get full text |
Cover
Loading…
Summary: | Techniques and mechanisms for configuring an integrated circuit, IC, chip (120) to implement a protocol stack. In an embodiment, a transaction layer of the IC chip (120) is operable to exchange with a link layer of the IC chip transaction layer packets, TLPs, having a format compatible with one defined in a Peripheral Component Interconnect Express?, PCIe?, specification. Configuration circuitry of the IC chip (120) provides for configuration of a first protocol stack including the transaction layer (130), circuitry of the link layer (132) and a first physical layer (134) of the IC chip (120). The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information. |
---|---|
Bibliography: | Application Number: MY2014PI700666 |