METHOD FOR PLATING WIRING BOARD, AND WIRING BOARD

• Main Authors: HISHINUMA, RYOUHEI, FUKUHARA, KUNIAKI, NEMOTO, KOUJI, OOTA, YOSUKE
• Format: Patent
• Language: English
• Published: 30.05.2014
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

THERE ARE PROVIDED A METHOD FOR PLATING A WIRING BOARD, CHARACTERIZED IN THAT: IN ORDER TO SELECTIVELY PLATE A PLATING TARGET AREA ON THE WIRING BOARD HAVING A CIRCUIT PATTERN HAVING AN UNEVENNESS OF 25 µm OR MORE FORMED ON AN INSULATING SUBSTRATE, WHEN AREAS OTHER THAN THE PLATING TARGET AREA ARE MASKED, USING A MASKING FILM OBTAINED BY SEQUENTIALLY LAMINATING AN ADHESIVE LAYER AND A RELEASE SHEET ON ONE SURFACE OF A POLYBUTYLENE TEREPHTHALATE FILM; REMOVING THE RELEASE SHEET OF THE MASKING FILM; THEN, BONDING THE ADHESIVE LAYER SURFACE OF THE MASKING FILM TO A PREDETERMINED AREA ON THE WIRING BOARD UNDER AN ENVIRONMENT AT ROOM TEMPERATURE, FOLLOWED BY THERMOCOMPRESSION BONDING; AND THEN, PLATING THE PLATING TARGET AREA; AND A WIRING BOARD USING THE METHOD. AN AREA NOT TO BE PLATED IS NOT PLATED BY ENTRY OF A PLATING SOLUTION EVEN IF THE WIRING BOARD HAS A LARGE UNEVENNESS IS THE CIRCUIT PATTERN. FURTHERMORE, PUNCHING WORKABILITY OF THE MASKING FILM, AND, IN PARTICULAR, GENERATION OF A BURR, UNSUCCESSFUL HOLE-MAKING, AND THE LIKE IS INHIBITED. (FIGURE 2)