FLUX FOR SOLDERING, SOLDERING METHOD, AND PRINTED CIRCUIT BOARD

A FLUX FOR SOLDERING USED WHEN SOLDERING IS PERFORMED TO A BOARD SUBJECTED TO ELECTROLESS NICKEL PLATING; THE FLUX CONTAINING RESIN HAVING FILM FORMING ABILITY, ACTIVATOR, AND SOLVENT, AND FURTHER CONTAINING METALLIC SALT OF ORGANIC ACID IN AN AMOUNT OF 0.1 TO 20% BY WEIGHT OF THE TOTAL AMOUNT OF FL...

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Bibliographic Details
Main Authors KAZUKI IKEDA, TOSHINORI SHIMA, TAKAAKI ANADA, SYUNSUKE ISHIKAWA, HISAO IRIE
Format Patent
LanguageEnglish
Published 15.01.2010
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A FLUX FOR SOLDERING USED WHEN SOLDERING IS PERFORMED TO A BOARD SUBJECTED TO ELECTROLESS NICKEL PLATING; THE FLUX CONTAINING RESIN HAVING FILM FORMING ABILITY, ACTIVATOR, AND SOLVENT, AND FURTHER CONTAINING METALLIC SALT OF ORGANIC ACID IN AN AMOUNT OF 0.1 TO 20% BY WEIGHT OF THE TOTAL AMOUNT OF FLUX; AND THE ACTIVATOR IS ORGANIC ACID THAT IS THE SAME AS ORGANIC ACID COMPOSING THE METALLIC SALT OF ORGANIC ACID, OR ORGANIC ACID HAVING A LOWER ACIDITY THAN THAT. THEREBY, THE STABILITY OF METAL SALT OF ORGANIC ACID CAN IMPROVE AND HIGH BONDING STRENGTH CAN BE MAINTAINED FOR A LONG PERIOD OF TIME.
Bibliography:Application Number: MY2004PI04864