ADHESIVE FOR INSULATIVE ARTICLES

• Main Authors: Daniel WASKI, Kristina THOMPSON, Kris GETTY, Tianjian HUANG
• Format: Patent
• Language: English; Spanish
• Published: 12.08.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; IMPREGNATING OR COATING OF PAPER; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PAPER NOT OTHERWISE PROVIDED FOR; PAPER-MAKING; PERFORMING OPERATIONS; POLISHES; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; PRODUCTION OF CELLULOSE; PULP COMPOSITIONS; TEXTILES; TRANSPORTING; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; USE OF MATERIALS AS ADHESIVES

An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 110°C; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70°C to 110°C; and (iii) a tan d value less than 0.6 at 90°C. Se proporciona una composición de adhesivo que mejora las propiedades de aislamiento e integridad estructural cuando se aplica a un sustrato celulósico. La composición de adhesivo incluye una pluralidad de microesferas y un polímero basado en emulsión que tiene (i) un módulo elástico mayor que 0.5MPa en el intervalo de temperatura, intervalo de 70°C a 110°C; (ii) una pendiente log(E) /T absoluta de menos de 0.05 en el intervalo de temperatura, intervalo de 70°C a 110°C; y (iii) un valor tan d de menos de 0.6 a 90°C.