EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE ENCAPSULATED THEREBY

The epoxy resin is composed of 100 wt% epoxy resin like biphenyl epoxy resin, novolak epoxy resin, moified novolak epoxy resin or bisphenol epoxy resin of A type, 10-80 wt% phenol resin like novolak phenol resin, phenolalkyl resin, bisphenol of A type or modified phenol resin, 20-70 wt% modified vin...

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Bibliographic Details
Main Authors PARK, SE - DONG, CHO, YONG - SUK, SIM, JAE - WOOK
Format Patent
LanguageEnglish
Published 23.07.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The epoxy resin is composed of 100 wt% epoxy resin like biphenyl epoxy resin, novolak epoxy resin, moified novolak epoxy resin or bisphenol epoxy resin of A type, 10-80 wt% phenol resin like novolak phenol resin, phenolalkyl resin, bisphenol of A type or modified phenol resin, 20-70 wt% modified vinylester resin, 1-20 wt% coupling agent, 500-900 wt% filler like synthetic silicon containing uranium and thorium below 1.0 ppb and other additives.
Bibliography:Application Number: KR19920026310