A SAWING APPARATUS HAVING CLEANING FUNCTION FOR BLADE
절삭 장치는 피 가공물을 절삭하는 절삭부 및 상기 절삭부의 측면의 상측에 배치되고, 상기 절삭부의 회전 방향에 대향하여 배치되고, 상기 절삭부의 일측면을 향해 액체를 분사하는 제 1 노즐을 포함한다.
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| Main Authors | , , |
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| Format | Patent |
| Language | English Korean |
| Published |
27.06.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | 절삭 장치는 피 가공물을 절삭하는 절삭부 및 상기 절삭부의 측면의 상측에 배치되고, 상기 절삭부의 회전 방향에 대향하여 배치되고, 상기 절삭부의 일측면을 향해 액체를 분사하는 제 1 노즐을 포함한다. |
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| AbstractList | 절삭 장치는 피 가공물을 절삭하는 절삭부 및 상기 절삭부의 측면의 상측에 배치되고, 상기 절삭부의 회전 방향에 대향하여 배치되고, 상기 절삭부의 일측면을 향해 액체를 분사하는 제 1 노즐을 포함한다. |
| Author | PARK DEOK SU RYU KI UNG LEE HONG JOO |
| Author_xml | – fullname: LEE HONG JOO – fullname: RYU KI UNG – fullname: PARK DEOK SU |
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| Snippet | 절삭 장치는 피 가공물을 절삭하는 절삭부 및 상기 절삭부의 측면의 상측에 배치되고, 상기 절삭부의 회전 방향에 대향하여 배치되고, 상기 절삭부의 일측면을 향해 액체를 분사하는 제 1 노즐을 포함한다. |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| Title | A SAWING APPARATUS HAVING CLEANING FUNCTION FOR BLADE |
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