열전도성 필름
본 발명은, (A)DmTΦpDVin(식 중, D는 (CH3)2SiO2/2, TΦ는 (C6H5)SiO3/2, DVi는 (CH3)(CH2=CH)SiO2/2로 표시되는 실록산단위이며, m은 35~55의 정수, n은 30~60의 정수, p는 40~70의 정수이다.), 또는 MLDxTΦqDViy(식 중, M은 (CH3)3SiO1/2이며, L은 10~30의 정수, x는 15~35의 정수, y는 40~60의 정수, q는 45~55의 정수이다.)로부터 선택되는 1종 이상의 25℃에서 비유동성을 갖는 실리콘수지: 100질량부, (B)융점이 20~6...
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Format | Patent |
Language | Korean |
Published |
10.05.2024
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Abstract | 본 발명은, (A)DmTΦpDVin(식 중, D는 (CH3)2SiO2/2, TΦ는 (C6H5)SiO3/2, DVi는 (CH3)(CH2=CH)SiO2/2로 표시되는 실록산단위이며, m은 35~55의 정수, n은 30~60의 정수, p는 40~70의 정수이다.), 또는 MLDxTΦqDViy(식 중, M은 (CH3)3SiO1/2이며, L은 10~30의 정수, x는 15~35의 정수, y는 40~60의 정수, q는 45~55의 정수이다.)로부터 선택되는 1종 이상의 25℃에서 비유동성을 갖는 실리콘수지: 100질량부, (B)융점이 20~60℃인 왁스: 5~300질량부, (C)열전도성 충전재: 1,000~6,000질량부를 포함하는 것을 특징으로 하는 열전도성 필름이다. 이에 따라, 상온에서는 필름상이고 취급성이 좋은데다가, 열에 의해 연화하는 열전도성 필름을 제공한다.
The present invention is a thermally conductive film including: a silicone resin (A) at 100 parts by mass, the silicone resin being one or more selected from: DmTϕpDVin, wherein D represents a siloxane unit represented by (CH3)2SiO2/2, Tϕ represents a siloxane unit represented by (C6H5)SiO3/2, DVi represents a siloxane unit represented by (CH3)(CH2=CH)SiO2/2, "m" represents an integer of 35 to 55, "n" represents an integer of 30 to 60, and "p" represents an integer of 40 to 70; or MLDxTϕqDViy, wherein M represents (CH3)3SiO1/2, L represents an integer of 10 to 30, "x" represents an integer of 15 to 35, "y" represents an integer of 40 to 60, and "q" represents an integer of 45 to 55, the silicone resin having non-flowability at 25°C; a wax (B) having a melting point of 20 to 60°C at 5 to 300 parts by mass; and a thermally conductive filler (C) at 1,000 to 6,000 parts by mass. This provides a thermally conductive film being a film having good handleability at normal temperature, and being softened by heat. |
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AbstractList | 본 발명은, (A)DmTΦpDVin(식 중, D는 (CH3)2SiO2/2, TΦ는 (C6H5)SiO3/2, DVi는 (CH3)(CH2=CH)SiO2/2로 표시되는 실록산단위이며, m은 35~55의 정수, n은 30~60의 정수, p는 40~70의 정수이다.), 또는 MLDxTΦqDViy(식 중, M은 (CH3)3SiO1/2이며, L은 10~30의 정수, x는 15~35의 정수, y는 40~60의 정수, q는 45~55의 정수이다.)로부터 선택되는 1종 이상의 25℃에서 비유동성을 갖는 실리콘수지: 100질량부, (B)융점이 20~60℃인 왁스: 5~300질량부, (C)열전도성 충전재: 1,000~6,000질량부를 포함하는 것을 특징으로 하는 열전도성 필름이다. 이에 따라, 상온에서는 필름상이고 취급성이 좋은데다가, 열에 의해 연화하는 열전도성 필름을 제공한다.
The present invention is a thermally conductive film including: a silicone resin (A) at 100 parts by mass, the silicone resin being one or more selected from: DmTϕpDVin, wherein D represents a siloxane unit represented by (CH3)2SiO2/2, Tϕ represents a siloxane unit represented by (C6H5)SiO3/2, DVi represents a siloxane unit represented by (CH3)(CH2=CH)SiO2/2, "m" represents an integer of 35 to 55, "n" represents an integer of 30 to 60, and "p" represents an integer of 40 to 70; or MLDxTϕqDViy, wherein M represents (CH3)3SiO1/2, L represents an integer of 10 to 30, "x" represents an integer of 15 to 35, "y" represents an integer of 40 to 60, and "q" represents an integer of 45 to 55, the silicone resin having non-flowability at 25°C; a wax (B) having a melting point of 20 to 60°C at 5 to 300 parts by mass; and a thermally conductive filler (C) at 1,000 to 6,000 parts by mass. This provides a thermally conductive film being a film having good handleability at normal temperature, and being softened by heat. |
Author | AKABANE EMI ENDO AKIHIRO ISHIHARA YASUHISA |
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Snippet | 본 발명은, (A)DmTΦpDVin(식 중, D는 (CH3)2SiO2/2, TΦ는 (C6H5)SiO3/2, DVi는 (CH3)(CH2=CH)SiO2/2로 표시되는 실록산단위이며, m은 35~55의 정수, n은 30~60의 정수, p는 40~70의 정수이다.), 또는... |
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Title | 열전도성 필름 |
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