RESIN COMPOSITION ADHESIVE COATING AGENT CURED PRODUCT ADHESIVE SHEET COPPER FOIL WITH RESIN COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

• Main Authors: NAKAMURA TAIYO, YAMASHITA MADOKA, SUGIMOTO KEISUKE, SHIOTANI ATSUSHI, YAMAGUCHI TAKASHI, TASAKI TAKASHI
• Format: Patent
• Language: English; Korean
• Published: 21.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

＜과제＞ 접착제로서 사용했을 때에는 접착성, 땜납 내열성, 내습열성 및 내마이그레이션성이 뛰어난 경화물을 주고, 또 경화물을 수지 필름으로서 사용했을 때에도 뛰어난 땜납 내열성 및 높은 저장 탄성률을 나타내는 수지 조성물을 제공하는 것에 있다. ＜해결 수단＞ 방향족 테트라카복실산무수물(a1) 및 다이머디아민을 포함하는 디아민(a2)을 포함하는 모노머군의 반응물인 폴리이미드(A), 일반식 (1)로 표시되는 가교제(B), 그리고 (B) 성분 이외의 경화제(C)를 포함하는 수지 조성물, 접착제, 코팅제, 경화물, 접착 시트, 수지부 동박, 동피복 적층판 및 프린트 배선판에 관한 것이다. JPEGpat00015.jpg52134 (식 (1)에 있어서 X1, X2 및 X3는 각각 독립하여 에폭시 골격을 하나 이상 가지는 기를 나타낸다) To provide a resin composition that produces a cured product with exceptional adhesion, resistance to solder heat, resistance to moist heat, and resistance to migration, wherein the cured product, when used as a resin film, also demonstrates outstanding solder heat resistance and a high storage modulus.SOLUTION: A resin composition comprises (A) a polyimide resulting from the reaction of a monomer group including an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) including a dimeric diamine, (B) a crosslinker represented by the general formula (1), and (C) a curing agent other than the component (B).SELECTED DRAWING: None