METAL CLAD LAMINATE AND CIRCUIT BOARD

• Main Authors: ANDO TOMONORI, SUTO YOSHIKI
• Format: Patent
• Language: English; Korean
• Published: 08.08.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

Provided is a polyimide film which achieves both a low dielectric loss tangent and excellent long-term heat-resistant adhesion, and prevents reduction in adhesion to a metal layer even when being repeatedly exposed to a high temperature environment. Provided is a polyimide film which has a non-thermoplastic polyimide layer and a thermoplastic polyimide layer and satisfies (i) a coefficient of thermal expansion is in the range of 10-30 ppm/k, (ii) oxygen permeability is 5.5×10^-14 mol/(m^2*s*㎩) or less, and (iii) a ratio of monomer residues having a biphenyl skeleton with respect to all monomer residues derived from all monomer components constituting a non-thermoplastic polyimide and a thermoplastic polyimide is 50 mol% or more. [과제] 저유전 정접화와, 우수한 장기 내열 접착성의 양립이 도모되고, 반복하여 고온 환경에 노출되는 경우라도 금속층과의 접착성이 저하되기 어려운 폴리이미드 필름을 제공한다. [해결수단] 비열가소성 폴리이미드층과 열가소성 폴리이미드층을 갖는 폴리이미드 필름이며, (i) 열팽창 계수가 10 내지 30ppm/K의 범위 내인 것, (ii) 산소 투과도가 5.5×10-14㏖/(㎡·s·㎩) 이하인 것, (iii) 비열가소성 폴리이미드 및 열가소성 폴리이미드를 구성하는 전체 모노머 성분으로부터 유도되는 전체 모노머 잔기에 대해, 비페닐 골격을 갖는 모노머 잔기의 비율이 50㏖％ 이상인 것을 충족하는 폴리이미드 필름.