SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

• Main Authors: LEE YUN TAE, LEE JIN WON
• Format: Patent
• Language: English; Korean
• Published: 07.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present disclosure relates to a semiconductor package. The semiconductor package includes: a semiconductor chip including a FEOL (Front End Of Line) layer and a first BEOL (Back End Of Line) layer disposed on the FEOL layer; and a printed circuit board including a wiring layer and a second BEOL...